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KLAC
KLA Corporation
181.59
1 x 181.57
1 x 181.62
bid
ask
-
1.23
0.67%
03:38 PM
timesize
Ytd49.45%
1y104.82%
174.60
day range
182.51
84.39
52 week range
301.71
Open177.97Prev Close182.82Low174.60High182.51Mkt Cap238.81B
Vol6.71MAvg Vol12.94MEPS3.43P/E53.30Forward P/E41.15
Beta1.41Short Ratio2.34Inst. Own96.31%Dividend0.92Div Yield0.51
Ex Div Date05-18Earning07-2850-d Avg221.24200-d Avg162.531yr Est234.04
Earning
DateForEstimateReportedSurprisesurprise %
2026-10-282026-091.17N/AN/AN/A
2026-07-282026-0611.050.055.00%
2026-04-292026-030.920.940.022.51%
2026-01-292025-120.880.890.011.14%
2025-10-292025-090.860.880.022.33%
2025-07-312025-060.850.940.0910.59%
Upgrade / Downgrade
DateFirmActionFromTo
2026-07-10StifelUpgradeBuyBuy
2026-07-10NeedhamUpgradeBuyBuy
2026-07-09TD CowenUpgradeBuyBuy
2026-07-06Morgan StanleyUpgradeOverweightOverweight
2026-06-29Cantor FitzgeraldUpgradeOverweightOverweight
2026-06-23B of A SecuritiesUpgradeBuyBuy
Profile
KLA Corporation, together with its subsidiaries, designs, manufactures, and markets process control, process-enabling, and yield management solutions for the semiconductor and related electronics industries worldwide. The company operates through three segments: Semiconductor Process Control; Specialty Semiconductor Process; and PCB and Component Inspection. It offers inspection and review tools to identify, locate, characterize, review, and analyze defects on various surfaces of patterned and unpatterned wafers; metrology systems to measure pattern dimensions, film thickness, film stress, layer-to-layer alignment, pattern placement, surface topography, and electro-optical properties for wafers; chemical process control equipment; wired and wireless sensor wafers and reticles; wafer defect inspection, review, and metrology systems; reticle inspection and metrology systems; wafer inspection and metrology systems; and semiconductor software solutions that provide run-time process control, defect excursion identification, process corrections, and defect classification to accelerate yield learning rates and reduce production risk. The company also provides etch, plasma dicing, deposition, and other wafer processing technologies and solutions for the semiconductor and microelectronics industry. In addition, it offers direct imaging, inspection, optical shaping, inkjet and additive printing, and computer-aided manufacturing and engineering solutions for the PCB market and inspection and metrology systems for quality control and yield improvement in advanced and traditional semiconductor packaging markets. The company was formerly known as KLA-Tencor Corporation and changed its name to KLA Corporation in July 2019. KLA Corporation was incorporated in 1975 and is headquartered in Milpitas, California.
Insider Holder
DateNameRelationQuantityDescription
2024-11-05CALDERONI ROBERTDirector14.96KStock Award(Grant)
2026-02-04CALDERONI ROBERT MDirector15.23KStock Award(Grant)
2026-07-01HIGGINS BREN D.Chief Financial Officer263.47KSale
2025-11-11KHAN AHMAD AOfficer22.72KStock Gift
2026-07-01KIRLOSKAR VIRENDRA AOfficer19.58KSale
2024-11-05MOORE GARY BDirector15.03KStock Award(Grant)
Institution Ownership
Report DateOrganizationPositionValuePercentage
2025-12-30Vanguard Group Inc13.87M0.0010.62%
2026-03-30BlackRock Inc12.60M0.009.64%
2026-03-30Vanguard Capital Management, LLC8.52M0.006.52%
2026-03-30State Street Corp6.15M0.004.71%
2026-03-30Amvescap Plc.4.41M0.003.38%
2026-03-30FMR Inc4.40M0.003.37%
Fund Ownership
Report DateOrganizationPositionValuePercentage
2026-06-29Vanguard Total Stock Mkt Idx Inv41.48M0.003.18%
2026-06-29Vanguard 500 Index Investor33.93M0.002.60%
2026-06-29Invesco QQQ Trust27.73M0.002.12%
2026-06-29American Funds Washington Mutual A18.36M0.001.41%
2026-06-29iShares Core S&P 500 ETF18.02M0.001.38%
2026-06-29State Street® SPDR® S&P 500® ETF15.78M0.001.21%
Dividend
DividendDate
2.32026-05-18
1.92026-02-17
1.92025-11-17
1.92025-08-18
1.92025-05-19
1.72025-02-24
Split
SplitDate
10 : 12026-06-12
2 : 12000-01-19
2 : 11995-10-02
3 : 21984-12-17
2 : 11983-12-09
2 : 11983-01-10