Sectors

KLAC
KLA Corporation
233.03
1 x 232.99
3 x 233.07
bid
ask
+
10.78
4.85%
02:35 PM
timesize
Ytd91.78%
1y152.80%
218.89
day range
226.85
83.22
52 week range
307.37
Open221.55Prev Close222.25Low218.89High226.85Mkt Cap290.32B
Vol4.13MAvg Vol12.35MEPS27.98P/E7.94Forward P/E45.43
Beta1.41Short Ratio2.34Inst. Own93.71%Dividend0.92Div Yield0.40
Ex Div Date05-18Earning07-2850-d Avg212.90200-d Avg155.071yr Est228.61
Earning
DateForEstimateReportedSurprisesurprise %
2026-04-292026-039.169.40.242.62%
2026-01-292025-128.828.850.030.34%
2025-10-292025-098.558.810.263.04%
2025-07-312025-068.539.380.859.96%
2025-04-302025-038.068.410.354.34%
2025-01-302024-127.738.20.476.08%
Upgrade / Downgrade
DateFirmActionFromTo
2026-07-10StifelUpgradeBuyBuy
2026-07-10NeedhamUpgradeBuyBuy
2026-07-09TD CowenUpgradeBuyBuy
2026-07-06Morgan StanleyUpgradeOverweightOverweight
2026-06-29Cantor FitzgeraldUpgradeOverweightOverweight
2026-06-23B of A SecuritiesUpgradeBuyBuy
Profile
KLA Corporation, together with its subsidiaries, designs, manufactures, and markets process control, process-enabling, and yield management solutions for the semiconductor and related electronics industries worldwide. The company operates through three segments: Semiconductor Process Control; Specialty Semiconductor Process; and PCB and Component Inspection. It offers inspection and review tools to identify, locate, characterize, review, and analyze defects on various surfaces of patterned and unpatterned wafers; metrology systems to measure pattern dimensions, film thickness, film stress, layer-to-layer alignment, pattern placement, surface topography, and electro-optical properties for wafers; chemical process control equipment; wired and wireless sensor wafers and reticles; wafer defect inspection, review, and metrology systems; reticle inspection and metrology systems; wafer inspection and metrology systems; and semiconductor software solutions that provide run-time process control, defect excursion identification, process corrections, and defect classification to accelerate yield learning rates and reduce production risk. The company also provides etch, plasma dicing, deposition, and other wafer processing technologies and solutions for the semiconductor and microelectronics industry. In addition, it offers direct imaging, inspection, optical shaping, inkjet and additive printing, and computer-aided manufacturing and engineering solutions for the PCB market and inspection and metrology systems for quality control and yield improvement in advanced and traditional semiconductor packaging markets. The company was formerly known as KLA-Tencor Corporation and changed its name to KLA Corporation in July 2019. KLA Corporation was incorporated in 1975 and is headquartered in Milpitas, California.
Insider Holder
DateNameRelationQuantityDescription
2024-11-05CALDERONI ROBERTDirector14.96KStock Award(Grant)
2026-02-04CALDERONI ROBERT MDirector15.23KStock Award(Grant)
2026-07-01HIGGINS BREN D.Chief Financial Officer263.47KSale
2025-11-11KHAN AHMAD AOfficer22.72KStock Gift
2026-07-01KIRLOSKAR VIRENDRA AOfficer19.58KSale
2024-11-05MOORE GARY BDirector15.03KStock Award(Grant)
Institution Ownership
Report DateOrganizationPositionValuePercentage
2026-03-30Blackrock Inc.125.96M29.16B96.43%
2026-03-30Vanguard Capital Management LLC85.19M19.72B65.22%
2026-03-30State Street Corporation61.54M14.25B47.11%
2026-03-30FMR, LLC44.01M10.19B33.69%
2026-03-30Capital World Investors40.84M9.46B31.26%
2026-03-30Vanguard Portfolio Management LLC40.29M9.33B30.84%
Fund Ownership
Report DateOrganizationPositionValuePercentage
2026-03-30VANGUARD INDEX FUNDS-Vanguard Total Stock Market Index Fund41.62M9.64B31.86%
2026-03-30VANGUARD INDEX FUNDS-Vanguard 500 Index Fund33.31M7.71B25.50%
2026-05-30Invesco QQQ Trust, Series 128.40M6.58B21.74%
2026-05-30iShares Trust-iShares Core S&P 500 ETF17.27M4.00B13.22%
2026-05-30Fidelity Concord Street Trust-Fidelity 500 Index Fund16.77M3.88B12.84%
2026-04-29WASHINGTON MUTUAL INVESTORS FUND16.00M3.70B12.25%
Dividend
DividendDate
2.32026-05-18
1.92026-02-17
1.92025-11-17
1.92025-08-18
1.92025-05-19
1.72025-02-24
Split
SplitDate
10 : 12026-06-12
2 : 12000-01-19
2 : 11995-10-02
3 : 21984-12-17
2 : 11983-12-09
2 : 11983-01-10