Sectors

AEHR
Aehr Test Systems
97.91
1 x 97.83
1 x 98.02
bid
ask
+
20.55
26.56%
01:02 PM
timesize
Ytd384.94%
1y495.20%
83.17
day range
98.05
16.45
52 week range
116.58
Open83.25Prev Close77.36Low83.17High98.05Mkt Cap2.43B
Vol3.29MAvg Vol2.62MEPS0.03P/E2578.67Forward P/E9.86
Beta3.17Short Ratio2.40Inst. Own71.70%DividendN/ADiv YieldN/A
Ex Div DateN/AEarning07-1450-d Avg94.21200-d Avg50.491yr Est115.00
Earning
DateForEstimateReportedSurprisesurprise %
2026-04-072026-020N/A0.0337.50%
2026-01-082025-110N/A0.0450.00%
2025-10-062025-080.010.01N/AN/A
2025-07-082025-050N/AN/AN/A
2025-04-082025-020.010.070.06600.00%
2025-01-132024-110.030.02-0.01-33.33%
Upgrade / Downgrade
DateFirmActionFromTo
2026-03-05Freedom BrokerUpgradeHoldHold
2026-03-02William BlairUpgradeMarket PerformOutperform
2026-02-13Freedom BrokerUpgradeHoldHold
2026-01-13Freedom BrokerUpgradeHoldHold
2026-01-09Craig-HallumUpgradeHoldHold
2025-12-17Lake StreetUpgradeBuy
Profile
Aehr Test Systems, Inc. provides test solutions for testing, burning-in, and semiconductor devices in wafer level, singulated die, package part form, and installed systems in the United States, Asia, and Europe. Its product portfolio includes FOX-XP and FOX-NP systems that are full wafer contact and singulated die/module test and burn-in systems that test, burn-in, and stabilize range of devices, including silicon carbide-based and other power semiconductors, 2D, and 3D sensors used in mobile phones, tablets and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The company offers FOX-CP system, a low-cost single-wafer compact test solution for logic, memory, and photonic devices; and FOX WaferPak Contactor, a full wafer contactor capable of testing wafers up to 300mm that enables integrated circuit manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. In addition, it provides FOX DiePak Carrier, which allows testing, burning in, and stabilization of singulated bare die and modules; and FOX DiePak Loader. The company was incorporated in 1977 and is headquartered in Fremont, California.
Insider Holder
DateNameRelationQuantityDescription
2026-06-30ENGINEER ADILChief Operating Officer47.51KStock Award(Grant)
2026-06-30ERICKSON GAYLORDChief Executive Officer404.15KStock Award(Grant)
2026-06-30POSEDEL RHEA JDirector443.53KStock Award(Grant)
2026-06-30RICHMOND DONALD P. IIChief Technology Officer187.42KStock Award(Grant)
2026-06-30ROGERS VERNONOfficer153.59KStock Award(Grant)
2026-06-30SALAMONE ALBERTOOfficer51.84KStock Award(Grant)
Institution Ownership
Report DateOrganizationPositionValuePercentage
2025-12-30Vanguard Group Inc2.34M0.007.20%
2026-03-30BlackRock Inc2.29M0.007.04%
2026-03-30FMR Inc2.14M0.006.60%
2026-03-30Awm Investment Company Inc1.59M0.004.91%
2026-03-30T. Rowe Price Associates, Inc.1.35M0.004.15%
2026-03-30Vanguard Capital Management, LLC1.28M0.003.95%
Fund Ownership
Report DateOrganizationPositionValuePercentage
2026-06-29Vanguard Total Stock Mkt Idx Inv951.20K0.002.93%
2026-03-30US Small-Cap Growth II Equity Comp817.39K0.002.52%
2026-06-29iShares Russell 2000 ETF790.58K0.002.43%
2026-06-29Vanguard Information Technology ETF709.53K0.002.18%
2026-04-29Fidelity Small Cap Growth671.81K0.002.07%
2026-06-29Invesco Dorsey Wright Technology MomtETF382.44K0.001.18%